S-BGN2 Introduction and Function Details
一. Introduction
(1) Baking Board: Used for baking motherboard, Auxiliary heating (Cleaning high-temperature tin from solder pads), Removing RAM/T2 chips, etc.
(2) CPU/GPU: Used for soldering large CPU processors (Such as Inter CPU, M1 Pro/Max, M2 Pro/Max, etc.), GPU (Graphics chip)
(3) Small CPU/PCH: Used for soldering small CPU processors (Such as A1932/A2179, M1, M2, M3, etc.), PCH (Platform Controller Hub)(4) Pause/Return: Pause (Stop/Start key), Return (Long press to return to the home page)
2.Introduction to each interface
1) ON/OFF: Switch key (Controls the main power input on and off)
2) AC~INPUT (110V-220V): AC power input, Supports 110V and 220V specifications
3) 30:00: 30-minute power protection. When the host works for 30 minutes in the same time period, the power will be automatically cut off. It plays a protective role in long-term heating
4) RESET: The button controls the working status of the host. After pressing the “RESET” button, the host will return to the working state and the working time will return to 30 minutes
1) Preheating: Indicates that the motherboard is preheating. When the progress bar reach 50%, you can use tweezers to remove the white glue around the chip.
2) Heating: Indicates that the heater is heating up.
3) Soldering: When the heating progress bar reach 100%, Preheating changes to Soldering, indicating that the motherboard has reached the soldering state.
4) In the Soldering state, the buzzer will sound. At this time, you can use air gun to assist in heating. After about one minute, remove the BGA chip
